EAG Application Notes - By Technique

Subcategory: Select category All categories AES Channeling EDS FIB FTIR GC/MS GDMS LEXES NRA Raman RBS SEM SIMS SPM/AFM TEM/STEM TOF-SIMS TXRF XPS/ESCA

• 二次离子质谱 (SIMS) 应用化合物半导体材料的定量分析 AN372CN
• 二次离子质谱 (SIMS) 应用：SiGe 器件微区分析 AN360CN
• 二次离子质谱仪的应用 AN419CN
• 二次離子質譜儀的應用 AN419TW
• 高精度 XPS 对 SiON 膜厚度和 N 剂量的测量 AN412CN
• Accuracy in SiON Thickness and N Dose Measurements by XPS AN412
• Accurate Dosimetry for High Dose Plasma Implanted Boron using PCOR-SIMS^SM AN435
• Accurate Near-Surface Shallow Boron Profiling using PCOR-SIMS^SM AN434
• Accurate Thin Film Measurements by High-Resolution Transmission Electron Microscopy (HRTEM) AN451
• Advanced SiGe SIMS Analyses, As in SiGe AN359
• Advanced Surface Analysis for Problem-Solving in Flat Panel Display Manufacturing AN443
• AFM: Polymer Surface Modification BN1210
• Analysis of a 0.2 µm Surface Defect Auger Electron Spectroscopy vs. Energy Dispersive X-ray Spectroscopy AN342
• Analysis of a 0.3 µm Surface Defect Auger Electron Spectroscopy vs. Energy Dispersive X-ray Spectroscopy AN341
• Analysis of Contaminants by DHS/GC/MS AN385
• Auger Electron Spectroscopy (AES) Technique Note TN101
• Automated Particle Analysis by SEM/EDS AN379
• Backside SIMS AN418
• Backside SIMS 在表面分析中的应用 AN418CN
• Backside SIMS 在表面分析中的應用 AN418TW
• Biomedical Applications of AFM: Imaging Hydrogel Coatings BN1424
• Cause and Location of Delamination of Multi-layer Metal Foil by XPS AN447
• Characterization Methods for Copper Technology AN192
• Characterization of Amorphous Silicon Using Secondary Ion Mass Spectrometry (SIMS) AN427
• Characterization of Oxidized GaAs Wafers by XPS AN377
• Characterization of Surface Aluminum Contamination on Processed Silicon Wafers Using SurfaceSIMS.XP AN393
• Characterization of Surface Contamination BN1365
• Cleanroom Materials as Sources of Airborne Molecular Contamination AN182
• Composition and Mapping of GeSbTe (GST) Films Using Low Energy X-ray Emission Spectrometry (LEXES) AN455
• Compositional Defect Review on the 300mm Whole Wafer SMART-Tool^TM and 200mm Whole Wafer SMART-200^TM Differentiates Particles that Look Alike but Originate From Different Sources AN429