EAG Services Overview

Evans Analytical Group® (EAG) is committed to providing you with high-quality reliability testing services for product qualification.

Our ESD and Latchup engineering group will work with you to design the most optimal testing scheme to meet your requirements. After testing, we provide a comprehensive report, and we can assist you in data interpretation. If there is a problem, we can help you with a complete set of Failure Analysis services, including Decap, Optical Microscopy, FIB, FE-SEM, and TEM. Such integrated services can assist you in locating your ESD/EOS defect.

EAG offers state-of-the-art on-chip circuit modification such as device repair/modification, device isolation, and probe pad formation. Circuit edit is growing in importance in the semiconductor industry. As new materials such as copper and low-k dielectrics are introduced and advanced technologies such as flip-chip packaging are incorporated into devices with smaller geometries and greater complexity, errors in design or processing become more likely. Circuit edit can help find and correct errors in prototypes, shortening the design cycle and saving development time and money.

To learn more about a particular Evans Analytical Group® (EAG) services, click one of the links below or on the left. For more in-depth information, contact one of our 15 analytical labs, where analysts are available to answer your questions.

• ATE
• ESD/Latchup
• Failure Analysis
• FIB - Circuit Edit
• Decapsulation
• Reliability Qualification